Location
Asia/ Japan/ Osaka
Date
2026/05/13
~
2026/05/15
339Last
Day
Day
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Contact Person
Maureen Chen
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Automobiles, Automotive Engineering | Consumer Electronics | Engineering, Manufacturing & Processing, Smart Manufacturing | Machine Tools, Metalworking, Automation | Semiconductor, Electronics, Electrical Engineering
Adhesion & Bonding Expo Osaka 2026
Japan's Largest Show for All Industrial Adhesion & Bonding Technologies!
